The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 16, 1997
Filed:
Dec. 16, 1996
Applicant:
Inventors:
Hisashi Masumura, Fukushima-ken, JP;
Kiyoshi Suzuki, Fukushima-ken, JP;
Assignee:
Shin-Etsu Handotai Co., Ltd., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
C09G / ;
U.S. Cl.
CPC ...
106-3 ; 51308 ;
Abstract
A polishing agent used for polishing a silicon wafer is composed of a colloidal silica polishing agent containing an ethyl silicate monomer and/or an ethyl silicate polymer. Even when the polishing agent is used with a rigid polishing pad, it is able to provide a polished wafer having an excellent flatness and whose surface has a roughness comparable to that obtained by the conventional final polishing process.