The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 06, 1997
Filed:
Oct. 18, 1995
Applicant:
Inventors:
Masami Nakano, Fukushima-ken, JP;
Isao Uchiyama, Fukushima-ken, JP;
Hiroyuki Takamatsu, Shirakawa, JP;
Assignee:
Shin-Etsu Handotai Co., Ltd., Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B08B / ;
U.S. Cl.
CPC ...
134-3 ; 216 88 ; 438691 ; 438753 ;
Abstract
An improved semiconductor wafer cleaning method capable of cleaning wafers without degrading the surface roughness of the wafers includes the steps of cleaning a polished wafer with an aqueous solution of hydrofluoric acid, then rinsing the wafer with ozone-containing water, and thereafter brush-scrubbing the wafer.