The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 22, 1997

Filed:

Aug. 02, 1996
Applicant:
Inventors:

Raed A Sherif, Hopewell Junction, NY (US);

Mark G Courtney, Poughkeepsie, NY (US);

David L Edwards, Poughkeepsie, NY (US);

Albert J Fahey, Pasadena, CA (US);

Gregory S Hopper, Fishkill, NY (US);

Sushumna Iruvanti, Wappingers Falls, NY (US);

Charles F Jones, Poughkeepsie, NY (US);

Gaetano P Messina, Hopewell Junction, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361705 ; 165 802 ; 165185 ; 257706 ; 257713 ; 361715 ; 361717 ; 361722 ;
Abstract

The present invention relates generally to a new apparatus and method for customized cooling of chips using a plurality of thermally conductive materials. More particularly, the invention encompasses an apparatus and a method that provides customized cooling of a MCM (Multi-Chip Module) by using a plurality of thermally conductive materials.


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Sherif, Raed. (1997). Apparatus for cooling of chips using a plurality of customized thermally (U.S. Patent No. 5623394). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5623394

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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