The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 15, 1997
Filed:
Apr. 17, 1995
Hitoshi Misaka, Fukushima-ken, JP;
Kouichi Tanaka, Fukushima-ken, JP;
Morifumi Matsumoto, Fukushima-ken, JP;
Kouji Morita, Fukushima-ken, JP;
Shin-Etsu Handotai Co., Ltd., Tokyo, JP;
Abstract
A polishing method and apparatus for reducing wafer taper in single-wafer polishing are disclosed, by which the whole processes from measurement of thickness profile of wafers and polishing thereof are fully automated and the working efficiency is not only improved, but also the polished wafers are produced with high accuracy in reduction of the taper thereof. The present invention is executed as follows: Thickness profiles of a wafer is measured with a measurement instrument of thickness in X,Y direction mutually perpendicular, and the taper T and stock removal S.sub.0 are determined from the thickness profiles with the method of least squares by a CPU and further the eccentricity .delta., which is the distance between the center of the wafer and that of pressing force, is determined with the help of an equation