The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 1997
Filed:
Mar. 27, 1996
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
A semiconductor wafer is affixed on a dicing sheet having an appropriate expansibility. Then, a dicing operation is performed on the semiconductor wafer without dividing the dicing sheet, thereby dividing a plurality of semiconductor chips from each other. After aligning a contactor against the semiconductor wafer, the semiconductor wafer is fixed to the contactor. In this case, protrusions provided on the contactor are inserted into the gap between semiconductor chips. The protrusions cause a shift movement toward the peripheral edge of the contactor in response to thermal expansion of the contactor, thereby expanding the gap between semiconductor chips. Then a burn-in is performed on all of the plural semiconductor chips of which gap is expanded.