The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 1997
Filed:
Jul. 17, 1995
Applicant:
Inventor:
Kuang-Chih Wang, Taichung Hsien, TW;
Assignee:
Winbond Electronics Corp., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
437190 ; 437192 ; 437194 ;
Abstract
A contact metallization process which includes a Ti glue layer has been disclosed. The Ti glue layer is formed between a barrier metal layer and an Al-based layer. The Ti glue layer prevents formation of etch resistant precipitants in or on the Al-based layer. The Ti glue layer reacts with the aluminum based layer to form TiAl.sub.3 which dissolves the precipitates. The inventive process allows proper etching of the Al-based layer and eliminates bridging.