The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 1996

Filed:

Oct. 27, 1995
Applicant:
Inventors:

Ching-Ying Lee, Hsin Chu, TW;

Shaw-Tzeng Hsia, Taipei, TW;

Haw Yen, Hsin-chu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
437190 ; 437192 ; 437200 ; 437 26 ;
Abstract

A process has been developed that allows small diameter contact holes to be filled with chemical vapor deposited tungsten, without tungsten peeling from the sides of the contact hole. The process consists of initially depositing an adhesive layer of titanium in the contact hole, followed by a rapid thermal anneal cycle, in an ammonia ambient, for purposes of creating a thin, uniform, barrier layer of titanium nitride. The titanium nitride protects the underlying titanium adhesion layer from the by-products introduced during the tungsten deposition, specifically the evolution of fluorine ions resulting from the decomposition of tungsten hexafluoride.


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