Wire interconnect structures for connecting an integrated circuit to a

Abstract

Methods of constructing a wire interconnect structure on a substrate are described. The methods broadly comprise the steps of depositing a spacer layer on a surface of the substrate, depositing a mask layer on the spacer layer, and removing a first portion of the mask layer overlying a desired area on the substrate surface to expose the spacer layer underlying the first portion of the mask layer. The methods further comprise the step of etching the structure such that a first portion of the spacer layer overlaying the desired area is removed and such that a portion of the desired area is exposed, and the step of depositing a first conductive material on the exposed portion of the desired area such that a conductive post is formed on the substrate surface and mounted to the desired area. Some of the disclosed methods comprise additional steps for forming an interconnect structure on the opposite surface of the substrate and providing an electrical interconnect means between the two interconnect structures. Additionally, some of the disclosed methods comprise steps for forming fillets around the conductive post at the substrate surface.