The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 1996
Filed:
Jan. 29, 1992
Applicant:
Inventors:
Shaji Farooq, Hopewell Junction, NY (US);
Sampath Purushothaman, Yorktown Heights, NY (US);
Srinivasa S Reddy, LaGrangeville, NY (US);
Vivek M Sura, Hopewell Junction, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B / ; H01L / ;
U.S. Cl.
CPC ...
428623 ; 428629 ; 428660 ; 428680 ; 428672 ; 428674 ; 428675 ; 428647 ; 428648 ;
Abstract
A ceramic substrate having an improved I/O pad adhesion layer. The ceramic substrate has an I/O pad for joining to an I/O pin. The I/O pad includes an improved adhesion layer of TiO, followed by layers of Ti (or Ti and Ni) and a solder wettable layer which may be Au or Pt. Also disclosed are low yield stress solders of Sn/Sb, Sn/Ag, Sn/Cu and Sn/Cu/Ti.
Farooq, Shaji. (1996). I/o pad adhesion layer for a ceramic substrate (U.S. Patent No. 5532031). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5532031
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile