The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 07, 1996
Filed:
Oct. 27, 1994
Applicant:
Inventors:
Toshiyuki Sakuta, Hamura, JP;
Kazuyuki Miyazawa, Irume, JP;
Satoshi Oguchi, Ohme, JP;
Aizo Kaneda, Yokohama, JP;
Masao Mitani, Yokohama, JP;
Shozo Nakamura, Yokohama, JP;
Kunihiko Nishi, Kokubunji, JP;
Gen Murakami, Machida, JP;
Assignee:
Hitachi, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
257666 ; 257692 ; 257783 ; 257786 ;
Abstract
A semiconductor device is provided in connection with a semiconductor chip which has a plurality of bonding pads at a part corresponding to a centrally located area of the front or first main surface thereof, an organic insulator film which overlies the semiconductor chip and which has an opening in correspondence with the bonding pads, a plurality of leads which overly the organic insulator film, and a molding resin with which these constituents are sealed or packaged.