The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 1996
Filed:
Aug. 29, 1995
Gary S Calabrese, North Andover, MA (US);
Jeffrey M Calvert, Burke, VA (US);
Mu-San Chen, Ellicott, MD (US);
Walter J Dressick, Fort Washington, MD (US);
Charles S Dulcey, Washington, DC (US);
Jacque H Georger, Jr, Holden, MA (US);
John F Bohland, Jr, Berlin, MA (US);
Shipley Company Inc., Marlborough, MA (US);
Abstract
The invention is directed to a process for patterning a substrate in a selective pattern. In one embodiment, the process comprises the steps of forming a patterned coating over a substrate surface whereby portions of the substrate are covered by the patterned coating and portions of the substrate remain uncoated. A layer of a ligating material is coated over at least those portions of the substrate free of the patterned coating. The ligating layer is one that is capable of ligating with an electroless metal plating catalyst. The article so formed is then contacted with an electroless metallization catalyst and then with an electroless plating solution to form a patterned metal deposit on the substrate.