The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 23, 1996
Filed:
Dec. 28, 1994
Applicant:
Inventors:
Nobuto Yamazaki, Higashi, JP;
Ryuichi Kyomasu, Kodaira, JP;
Assignee:
Kabushiki Kaisha Shinkawa, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H / ;
U.S. Cl.
CPC ...
310323 ; 310328 ; 228 11 ; 2281101 ;
Abstract
A bonding apparatus with an ultrasonic horn for manufacturing, for example, semiconductor devices having a horn support that is used for mounting the ultrasonic horn to a bonding arm of the bonding apparatus, and tow vibration-generating sources are provided on both sides of the horn support. The vibration-generating sources are such a piezoelectric element as an electrostrictive strain element and a magnetostrictor.
Yamazaki, Nobuto. (1996). Bonding apparatus (U.S. Patent No. 5486733). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5486733
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