The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 27, 1995

Filed:

Dec. 29, 1992
Applicant:
Inventors:

Umar M Ahmad, Hopewell Junction, NY (US);

Harsaran S Bhatia, Hopewell Junction, NY (US);

Satya P Bhatia, Wappingers Falls, NY (US);

Hormazdyar M Dalal, Milton, NY (US);

William H Price, Courtland Manor, NY (US);

Sampath Purushothaman, Yorktown Heights, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
437192 ; 148D / ;
Abstract

A thin-layer metallization structure in which the final gold layer is deposited by evaporation with the surface onto which it is evaporated maintained at an elevated temperature. By evaporating the uppermost gold layer of the structure at an elevated substrate temperature, the gold atoms have a higher mobility, causing the deposited gold to spread over the edge of the structure and cover the otherwise exposed edges, including the edge at the copper interface.


Find Patent Forward Citations

Ahmad, Umar. (1995). Process for corrosion free multi-layer metal conductors (U.S. Patent No. 5427983). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5427983

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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