The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 27, 1995
Filed:
Dec. 29, 1992
Umar M Ahmad, Hopewell Junction, NY (US);
Harsaran S Bhatia, Hopewell Junction, NY (US);
Satya P Bhatia, Wappingers Falls, NY (US);
Hormazdyar M Dalal, Milton, NY (US);
William H Price, Courtland Manor, NY (US);
Sampath Purushothaman, Yorktown Heights, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A thin-layer metallization structure in which the final gold layer is deposited by evaporation with the surface onto which it is evaporated maintained at an elevated temperature. By evaporating the uppermost gold layer of the structure at an elevated substrate temperature, the gold atoms have a higher mobility, causing the deposited gold to spread over the edge of the structure and cover the otherwise exposed edges, including the edge at the copper interface.