The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 13, 1995
Filed:
Jul. 20, 1992
Masaru Nanpei, Ise, JP;
Akira Tomita, Ootsu, JP;
Keizo Kawahara, Ootsu, JP;
Toshihiko Kajima, Okayama, JP;
Toyo Boseki Kabushiki Kaisha, Osaka, JP;
Abstract
A photosensitive resin composition includes (A) a hydrophobic polymer having a glass transition temperature not greater than 5.degree. C., (B) a hydrophilic polymer, (C) an ethylenically unsaturated compound, (D) a solvent capable of dissolving the component (B) more than the component (A) and (E) a photopolymerization initiator, with the content of component (B) being less than that of component (A). The resin composition can be used to prepare a printing plate having a base, a photosensitive resin layer and a covering layer arranged one over another. The photosensitive resin layer contains a dispersed phase which includes particles having a phase which includes a hydrophobic polymer, surrounded by a phase which includes a hydrophilic polymer. The photosensitive resin layer can be prepared by removing the solvent (D) to a content of 0.001-2% by weight.