Nondestructive testing apparatus and method

Abstract

The present invention comprises a test system for non-destructively testing the attachment strength of a plurality of electric wires each connected to a corresponding input/output (I/O) port in an integrated circuit (IC) dice. The test system comprises a test bench for placing said integrated circuit dice thereon. The test system further comprises a force asserting means including a testing pin for asserting a controlled amount of pressing force along a predefined direction to each of the electric wires near said corresponding I/O ports on said IC dice. The test system also includes a control means including a testing arm connecting to the testing pin for controlling and positioning the testing pin to apply the controlled amount of force to each of the electric wires. The control means further includes a force measurement means for measuring the amount of force applied to each of the electric wires. The control means further comprising a positioning means which includes a plurality of stepping motors for adjusting the position of the testing arm. A test computer is connected to the control means to control the control means whereby the testing processes are performed in an automated manner.