Metal plane support for multi-layer lead frames and a process for

Abstract

A metal plane support structure of a semiconductor device multi-layer lead frame having one or more metal planes, of different types, arranged in stacked and aligned relationship with and adhered to a corresponding lead frame. Metal planes of a common type are defined in a corresponding metal strip, at longitudinally spaced positions, the metal strip having a pair of side rails along the longitudinal edges thereof, integral support bars extending transversely of the side rails and interconnecting the metal planes to the side rails and section bars extending between and integrally interconnecting the side rails, each section bar disposed between two adjacent metal planes. Separating portions are formed in aligned relationship in the support bars and section bars. The lead frames are defined, further, at longitudinally spaced positions corresponding to the spacing of the metal planes, in a further metal strip having a smaller transverse dimension than that of each metal plane strip. In the assembled relationship of each metal plane with a corresponding lead frame, the side rails are diposed outwardly, in a transverse direction, from the side edges of the lead frame metal strip and are readily removed, along with the support bars and section bars, at the respective separating portions.