The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 1995
Filed:
Dec. 22, 1992
Applicant:
Inventors:
Soichi Katagiri, Hachiohji, JP;
Shigeo Moriyama, Tama, JP;
Tsuneo Terasawa, Ohme, JP;
Masaaki Itou, Higashimurayama, JP;
Assignee:
Hitachi, Ltd., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
G01B / ;
U.S. Cl.
CPC ...
356363 ; 356401 ; 356356 ;
Abstract
A semiconductor wafer includes a top surface on which a semiconductor circuit pattern is to be fabricated, and a bottom surface on which alignment marks for positioning the semiconductor circuit pattern are arranged. The alignment marks are arranged at a predetermined pitch and in an arrangement that is not unique to the pattern formed on the top surface.