The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 1995
Filed:
Oct. 08, 1993
Applicant:
Inventors:
Assignee:
Micron Technology, Inc., Boise, ID (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
257 48 ; 371 212 ; 257203 ;
Abstract
A semiconductor wafer comprises a plurality of individual dies containing integrated circuits which are substantially isolated from each other. The wafer is severable between the dies to physically singulate the dies from each other. The wafer includes test cycling circuitry for test cycling the individual dies. A Vcc bus and a Vss bus overly a passivation layer and are electrically connected through the passivation layer with Vcc and Vss pads associated with the individual dies.