The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 1995
Filed:
Jul. 23, 1993
Applicant:
Inventors:
Thomas H Distefano, Bronxville, NY (US);
Igor Y Khandros, Peekskill, NY (US);
Gaetan Mathiew, Carmel, NY (US);
Jason Sweis, Ossining, NY (US);
John Grange, Red Hook, NY (US);
Gary W Grube, Monroe, NY (US);
Assignee:
Tessera, Inc., Elmsford, NY (US);
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
22818021 ; 228212 ; 228 495 ;
Abstract
A bonding tool for bonding inner leads to semiconductor chips is arranged to capture and align elongated lead sections extending in any one of plural directions, and preferably, in any one of two mutually orthogonal directions. Thus, the tool can be applied to align and bond all of the leads to a chip without turning the tool or the chip even where the leads extend in multiple directions.