The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 1994
Filed:
Apr. 30, 1992
Applicant:
Inventors:
Isamu Yoshida, Yokohama, JP;
Junichi Saeki, Yokohama, JP;
Shigeharu Tsunoda, Fujisawa, JP;
Kunihiko Nishi, Kokubunji, JP;
Ichiro Anjoh, Koganei, JP;
Kenichi Imura, Koganei, JP;
Toshihiro Yasuhara, Kodaira, JP;
Junichi Arita, Musashino, JP;
Kazuhiro Sugino, Yokohama, JP;
Assignee:
Hitachi, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
437214 ; 437220 ; 26427217 ; 257667 ;
Abstract
A molding method in which a control plate having a size which is equal to or larger than the width of the outlet port of a supply passage are disposed in a cavity adjacent to the resin supply passage of a mold and thereby, the resin molding can be effected substantially equally at upper and lower sides of the insert comprising a semiconductor device and a lead.