The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 1994
Filed:
Mar. 19, 1992
Applicant:
Inventors:
Michio Sono, Kawasaki, JP;
Akihiro Kubota, Kawasaki, JP;
Junichi Kasai, Kawasaki, JP;
Masanori Yoshimoto, Kawasaki, JP;
Keiichi Masaki, Nagano, JP;
Assignee:
Fujitsu Limited, Kawasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R / ; B29B / ;
U.S. Cl.
CPC ...
29827 ; 2642711 ; 26427217 ;
Abstract
A process for producing a semiconductor device having a package with a semiconductor element molded therein, and a plurality of leads, each constituted by an inner lead located inside the package and an outer lead located outside the package, the leads being arranged in a line at a predetermined pitch, and the semiconductor element being electrically connected to the inner lead of each of the leads, wherein each side edge of each of the outer leads is flat.