The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 04, 1994
Filed:
Oct. 23, 1992
Tokyo Electron Limited, Tokyo, JP;
Tokyo Electron Yamanashi Limited, Nirasaki, JP;
Abstract
A wafer mount is arranged in a process chamber of the plasma etching apparatus. The rim section of a susceptor which serves as a mount body is curved at a large curvature radius. An electrostatic chuck sheet is arranged on the top of the susceptor and its rim is curved downward along the curved rim section of the susceptor, departing from the marginal portion of a semiconductor wafer mounted thereon as it comes outward. The rim of the electrostatic chuck sheet can be thus shortened in the horizontal direction and this enables a conductive film in the electrostatic chuck sheet to be made longer in the same direction. The electrostatic and thermal connection of the wafer to the electrostatic chuck sheet can be thus enhanced.