The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 07, 1993
Filed:
Oct. 04, 1991
Harsaran S Bhatia, Hopewell Junction, NY (US);
Mario J Interrante, New Paltz, NY (US);
Suresh D Kadakia, Poughkeepsie, NY (US);
Shashi D Malaviya, Hopewell Junction, NY (US);
Mark H McLeod, Poughkeepsie, NY (US);
Sudipta K Ray, Wappingers Falls, NY (US);
Herbert I Stoller, Wappingers Falls, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A direct distribution wiring system is provided which facilitates the effecting of repair or engineering change in a Multi-chip module (MCM) while eliminating the need for redistribution and/or buried connections between IC attachment pads and engineering change pads, thus eliminating the need for patterned conductor layers corresponding to such functions. The operation of the MCM is improved by the wiring system allowing the reduction of lumped capacitances by disconnection of defective conductors, accomplished by providing severable connectors in a direct distribution structure, as well as the elimination of redistribution wiring layers and increased IC density on the MCM. Full potential fault coverage as well as full discretion in reversible engineering changes is provided by forming all elements of the wiring system on the surface of the device.