The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 22, 1993
Filed:
Aug. 10, 1992
Applicant:
Inventors:
Yoshimitsu Terakado, Tokyo, JP;
Kazuo Sugiura, Tokyo, JP;
Assignee:
Kabushiki Kaisha Shinkawa, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
228102 ; 228110 ; 228-11 ; 228-8 ;
Abstract
In wire bonding performed in assembling, for example, semiconductor devices, the joining or bonding strength between a ball formed at an end of bonding wire and a bonding point is brought to a satisfactory level because of the use of small diameter balls with a little variation in diameter, and the bonding is performed by setting a load, that is applied on the ball when the ball contacts the bonding point, is set larger than when the ultrasonic waves are applied onto the ball.
Terakado, Yoshimitsu. (1993). Wire bonding method and apparatus (U.S. Patent No. 5221037). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5221037
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