The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 08, 1993
Filed:
Sep. 26, 1991
Steven L Mitchell, Boise, ID (US);
Warren M Farnworth, Boise, ID (US);
Micron Technology, Inc., Boise, ID (US);
Abstract
An improved system for the production of semiconductor devices is described. The invention incorporates conventional, known die attach technology and tape automated bonding technology with known technology for the selective placement of electroconductive material upon a polymer film, which is then enclosed in the same film, to create a system whereby typical integrated circuit die can be simultaneously attached, physically and electrically, to typical lead frames and lead fingers and other lead terminals, to produce a highly reliable integrated circuit, with low inductance between the die and the lead terminals, which may then be encapsulated and trimmed and formed, in known ways, to complete the assembled package.