The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 18, 1993
Filed:
Jul. 22, 1991
Nippon CMK Corp., , JP;
Abstract
A method of manufacturing a printed circuit board comprises providing an insulating substrate having opposed major sides, forming a through-hole between the two sides of the insulating substrate, forming a conductive land on both sides of the insulating substrate surrounding the ends of the through-hole, forming margining frames at the outer peripheries of the conductive lands, and packing conductive paste into the through-hole after the formation of the margining frames. The margining frames extend vertically beyond the height of the conductive lands and prevent the conductive paste from spreading outwardly beyond the outer peripheries of the conductive lands.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile