The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 06, 1993

Filed:

Sep. 11, 1990
Applicant:
Inventors:

Yuji Maruyama, Tokyo, JP;

Yukifumi Tsuda, Kawasaki, JP;

Kazutoshi Ikegaya, Sagamihara, JP;

Kunio Sannomiya, Atsugi, JP;

Hiroto Toba, Yokohama, JP;

Takumi Seto, Yokohama, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01B / ; H01J / ; G01N / ;
U.S. Cl.
CPC ...
356394 ; 250235 ; 250561 ;
Abstract

A system for inspecting a condition of parts packaged on a printed-circuit board. The inspection system includes a position detecting device to receive scattered light due to illumination of the printed-circuit board with a laser beam and convert the received scattered light into a position signal. This position signal is used for obtaining luminance data and at least two height data of the parts on the printed-circuit board. Proper height data of the parts is determined on the basis of the difference between the two height data. The inspection system determines the package condition by comparing the final height data with a predetermined reference data.


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