The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 23, 1993

Filed:

Feb. 24, 1992
Applicant:
Inventors:

Shin Kawakami, Iruma, JP;

Hirotaka Okonogi, Iruma, JP;

Katsutomo Nikaido, Iruma, JP;

Junichi Ichikawa, Iruma, JP;

Yoshio Nishiyama, Iruma, JP;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
29846 ;
Abstract

A method of manufacturing a printed circuit board comprises the steps of providing an insulating substrate for the printed circuit board, forming circuit patterns made of a conductive material on at least one side of the insulating substrate, forming an insulating layer on the circuit patterns, and adhering a cross-mesh shield layer onto at least a portion of the insulating layer in such a manner that a margin is placed both on the outer periphery of the insulating layer itself and around electric contacts such as lands and through-holes.


Find Patent Forward Citations

Kawakami, Shin. (1993). Method of manufacturing a printed circuit board (U.S. Patent No. 5195238). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5195238

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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