The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 15, 1992
Filed:
Oct. 04, 1991
John J Donelon, Mahopac, NY (US);
James P Doyle, Bronx, NY (US);
Jerry E Hurst, Jr, San Jose, CA (US);
Stephen M Rossnagel, White Plains, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
The present invention relates to a method of accessing and repairing electrical opens in conducting metal lines on a semiconductor chip or other substrate using a thin conductive layer formed within the surface of a substrate and laser plating techniques. What has been described is a maskless means of repairing discontinuities in a conductor disposed on the surface of a substrate wherein the surface is locally irradiated to form a reversible carbonaceous layer thereon. This reversible carbonaceous layer acts as a base for electrodeless deposition of a metal to form a bridge across the discontinuity by laser-enhanced exchange plating or other suitable methods. Further, a means of accessing and repairing a discontinuity buried by a cover layer of an insulating or passivating material is described, wherein access to the discontinuity is provided by ablating away the cover layer using a pulsed excimer laser at a first power level.