The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 1992
Filed:
Mar. 20, 1990
Kazumasa Yanagisawa, Kokubunji, JP;
Tatsuyuki Ohta, Ohme, JP;
Tetsu Udagawa, Iruma, JP;
Kyoko Ishii, Tokyo, JP;
Hitoshi Miwa, Ohme, JP;
Atsushi Nozoe, Ohme, JP;
Masayuki Nakamura, Ohme, JP;
Tetsurou Matsumoto, Higashiyamato, JP;
Yoshitaka Kinoshita, Kokubunji, JP;
Yoshiaki Ouchi, Fussa, JP;
Hiromi Tsukada, Kokubunji, JP;
Shoji Wada, Tokyo, JP;
Kazuo Mihashi, Sakaiminato, JP;
Yutaka Kobayashi, Katsuta, JP;
Goro Kitsukawa, HInode, JP;
Hitachi, Ltd., Tokyo, JP;
Hitachi VLSI Engineering Corp, Tokyo, JP;
Abstract
A Bi.CMOS semiconductor memory device is provided which includes an arrangement to simultaneously select a plurality of memory cells, followed by using a 3 bit Z addressing arrangement to determine a read or write operation for the simultaneously selected memory cells. To speed up the word line selection, a static selection type operation is used with the word line selecting voltage being greater than signal amplitude of the data lines during the write operation. Also, to speed up the read operation, separate common I/O lines are provided for the read and write operations. Read signals are transmitted as curent signals, and then converted to voltage signals for improving reading speed. Also, improved arrangements are provided for resistance structure, logic circuitry, input circuitry, fuse cutting circuitry, drive circuitry, power circuitry, electrostatic protection circuitry, layout structure and testing methods for the semiconductor device.