The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 1992

Filed:

Oct. 29, 1991
Applicant:
Inventor:

Been-Jon Woo, Saratoga, CA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
437 43 ; 437 46 ; 437 52 ; 437 49 ; 437162 ; 148D / ;
Abstract

A process for fabricating floating gates for electrically programmable and electrically erasable memory cells of the flash EPROM or EEPROM type. The floating gates are a three layer structure. The first layer of the floating gate is a thin polysilicon layer of approximately 300-500 .ANG. thickness. The second layer is a silicon dioxide layer of approximately 20-30 .ANG.. The third layer is polysilicon of approximately 1000-1500 .ANG. thickness. The third layer is doped by implantation of phosphorous. This dopant is driven through the oxide layer to dope the first, thin polysilicon layer in a separate diffusion step or in subsequent high temperature processing. The grain size of the first, thin polysilicon layer is small and uniform from gate to gate due to the thinness of this layer and its light doping. This reduces variations in threshold voltage from gate to gate due to variable polysilicon grain size and orientation. This in turn results in improved yield and cycling endurance.


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