The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 1992
Filed:
Oct. 05, 1990
Applicant:
Inventors:
Randal W Chance, Boise, ID (US);
Eugene H Cloud, Boise, ID (US);
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
357 55 ; 357 68 ; 357 65 ;
Abstract
Die bond locations on a semiconductor die are formed as vertical inserts along the edge of the die. The vertical inserts are isolated from substrate and are exposed by a wafer saw process, in which dice are singulated from a wafer. The configuration offers the advantages of a more efficient layout, allowing the entire top surface of the die to be passivated, a better contact configuration, and more convenient assembly for packaging.
Chance, Randal. (1992). Semiconductor package utilizing edge connected semiconductor dice (U.S. Patent No. 5146308). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5146308
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile