The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 1992

Filed:

Jun. 05, 1991
Applicant:
Inventors:

Takuro Iwamura, Omiya, JP;

Tsugio Koya, Omiya, JP;

Izumi Sukekawa, Tokyo, JP;

Hideru Hagiwara, Tokyo, JP;

Haruhiko Asao, Tokyo, JP;

Toshiaki Shigematsu, Tokyo, JP;

Hideki Sato, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22B / ;
U.S. Cl.
CPC ...
266160 ; 266217 ; 164473 ;
Abstract

Method and apparatus for manufacturing an oxygen-free copper having an oxygen content of no greater than 3 ppm by weight are disclosed. In the method, a deoxidizing step is carried out by bringing a reducing gas containing hydrogen gas into contact with a molten copper to react on the oxygen to remove the same. Then a dehydrogenation step may be carried out by bringing a gas of lean hydrogen concentration into contact with the molten copper. Accordingly, the apparatus has a deoxidizing device for blowing the reducing gas into the molten copper and preferably a dehydrogenation device.


Find Patent Forward Citations

Iwamura, Takuro. (1992). Apparatus for manufacturing oxygen-free copper (U.S. Patent No. 5143355). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5143355

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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