The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 1992
Filed:
Sep. 11, 1990
Takamasa Kawakami, Ibaraki, JP;
Satoru Makinose, Ibaraki, JP;
Kazuhiro Ando, Ibaraki, JP;
Rieko Nakano, Niigata, JP;
Mitsubishi Gas Chemical Co., Inc., Tokyo, JP;
Abstract
A process for producing a copper fine powder, which comprises thermally decomposing anhydrous copper formate in a solid phase in a non-oxidizing atmosphere at a temperature in the range of from 150.degree. to 300.degree. C., thereby yielding a copper fine powder having a primary particle diameter of from 0.2 to 1 .mu.m, a specific surface area of from 5 to 0.5 m.sup.2 /g and small agglomerating properties, said anhydrous copper formate being an anhydrous copper formate powder 90 wt % or more of which undergoes thermal decomposition within a temperature range of from 160.degree. to 200.degree. C. when the anhydrous copper formate powder is heated in a nitrogen or hydrogen gas atmosphere at a heating rate of 3.degree. C./min.