The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 10, 1991
Filed:
Aug. 03, 1989
Makoto Kitano, Niihari, JP;
Takahiro Daikoku, Ushiku, JP;
Sueo Kawai, Nishiibaraki, JP;
Ichio Shimizu, Sawa, JP;
Kazuo Yamazaki, Isesaki, JP;
Asao Nishimura, Ushiku, JP;
Hideo Miura, Niihari, JP;
Akihiro Yaguchi, Niihari, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A packaged semiconductor device having heat transfer leads carrying a semiconductor chip directly or indirectly through a chip pad and extended to the exterior of the plastic or ceramics seal of the package, and a heat transfer cap held in surface contact with the extended heat transfer leads and covering upper side of the package. The heat generated in the semiconductor chip is transmitted to the upper side of the package and to the printed circuit board only through metallic parts so that the heat transfer is enhanced to remarkably reduce thermal resistance, thus enabling packaging of a semiconductor chip having a large heat generation rate.