The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 10, 1991

Filed:

Oct. 16, 1989
Applicant:
Inventors:

Yuji Ohashi, Tokyo, JP;

Yoshimitsu Terakado, Tokyo, JP;

Minoru Torihata, Tokyo, JP;

Hiroshi Ushiki, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
228-9 ; 228102 ; 228-45 ;
Abstract

A bonding height detecting device used in a wire bonding machine which includes a rotatable axle provided on a bonding head, a moving block pivotally mounted on the rotatable axle, a bonding arm fixed on the rotatable axle, and a bonding tool attached to one end of the bonding arm through which a bonding wire is passed. The detecting device includes a lever fixed on the rotatable axle and having a first stopper and a detecting surface, a second stopper fixed on the moving block so that the second stopper is urged to contact the first stopper, a sensor fixture attached to the second stopper, and a proximate sensor mounted on the sensor mixture and facing the detecting surface of the lever.


Find Patent Forward Citations

Ohashi, Yuji. (1991). Device for detecting height of bonding surface (U.S. Patent No. 5046655). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5046655

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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