The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 10, 1991
Filed:
Oct. 16, 1989
Yuji Ohashi, Tokyo, JP;
Yoshimitsu Terakado, Tokyo, JP;
Minoru Torihata, Tokyo, JP;
Hiroshi Ushiki, Tokyo, JP;
Kabushiki Kaisha Shinkawa, Tokyo, JP;
Abstract
A bonding height detecting device used in a wire bonding machine which includes a rotatable axle provided on a bonding head, a moving block pivotally mounted on the rotatable axle, a bonding arm fixed on the rotatable axle, and a bonding tool attached to one end of the bonding arm through which a bonding wire is passed. The detecting device includes a lever fixed on the rotatable axle and having a first stopper and a detecting surface, a second stopper fixed on the moving block so that the second stopper is urged to contact the first stopper, a sensor fixture attached to the second stopper, and a proximate sensor mounted on the sensor mixture and facing the detecting surface of the lever.