The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 1991
Filed:
Feb. 01, 1990
Hiroaki Fujimoto, Hirakata, JP;
Kenzou Hatada, Katano, JP;
Yoshinobu Takeshita, Kagoshima, JP;
Kazuya Otani, Kagoshima, JP;
Koji Hidaka, Kushikino, JP;
Tsuguo Sakiyama, Kagoshima, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
A method for fabricating semiconductor devices comprising pressing first and second semiconductor devices against a transparent board at different times by means of first and second pressure tools that are separate from each other and move upward and downward independent of each other so that a difference in thickness between the devices and a deflection of the devices can be absorbed and a reliable electrical connection between the electrodes of the devices and the conductors of the board can be attained, which makes it possible to continuously achieve a highly dense assembly of semiconductor devices with a minute gap therebetween.