The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 16, 1991

Filed:

Dec. 20, 1989
Applicant:
Inventors:

Wen-Foo Chern, Boise, ID (US);

Ward M Parkinson, Boise, ID (US);

Thomas M Trent, Boise, ID (US);

Kevin G Duesman, Boise, ID (US);

James E O'Toole, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
357 51 ; 357236 ; 357 2313 ; 357 40 ; 357 42 ;
Abstract

An integrated cirucuit is provided with a depletion mode filter capacitor, which reduces voltage spiking, while at the same time avoiding latchup problems caused by the capacitor. The depletion mode capacitor has a barrier layer which is doped to an opposite conductivity type as the integrated circuit's substrate, achieved by doping to provide an opposite difference from four valence electrons as the substrate. The barrier is formed as a part of a CMOS process, in a manner which avoids additional process steps. The capacitor is formed with one node connected to ground or substrate, and the other node directly to a power bus. The capacitor is located on open space available on the whole siliocn chip (memory as well as logic chip), particularly directly underneath the metal power bus to achieve an on-chip power bus decoupling capacitor wth capacitance in excess of 0.001 .mu.F.


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