The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 1991

Filed:

Apr. 12, 1989
Applicant:
Inventors:

Akihiro Kawashima, Tenri, JP;

Hirokazu Yoshida, Osaka, JP;

Yasunobu Tagusa, Kitakatsuragi, JP;

Kiyoshi Inada, Joyo, JP;

Hideshi Makita, Tenri, JP;

Yoshihisa Dotta, Tenri, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02F / ; G03C / ;
U.S. Cl.
CPC ...
3503 / ; 350334 ; 350336 ; 430311 ;
Abstract

In a liquid crystal display apparatus, in order to reduce the size and weight, an integrated circuit for driving a liquid crystal is mounted on the glass substrate including the liquid crystal panel either directly or by way of a tape carrier. That is, two glass substrates of liquid crystal panel are mutually overlapped with an offset, and a liquid crystal material is injected into the overlapping regions of the two glass substrates, and liquid crystal display is effected in this region. Further, in the non-overlapping region of the two glass substrates, the integrated circuit is connected either directly or by way of a tape carrier. On the glass substrates, electrodes for varying the optical characteristics of the liquid crystals are provided, and the integrated circuit drives the liquid crystal by controlling the voltage applied to the electrodes. Further transparent insulation films are formed usually formed on the electrodes. The transparent insulation films are also formed in the non-overlapping region of the glass substrates. Since the transparent insulation films are finely patterned by photolithography, they may be selectively formed on the portions where defective insulation is likely to occur between the wiring conductors following the integrated circuit from the electrodes, or between the integrated circuit and the peripheral portion of the connecting part.


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