The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 1991
Filed:
Oct. 31, 1989
Applicant:
Inventors:
Assignee:
Kabushiki Kaisha Shinkawa, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ; H01L / ; B23K / ;
U.S. Cl.
CPC ...
228-45 ; 228-9 ; 228104 ;
Abstract
A wire bonding apparatus in which an air guide blows air against a bonding wire so that tension is applied to the bonding wire between a wire spool and a bonding tool so that the bonding wire comes in contact with a wire-contact. An optical sensor is provided near the wire-contact so that the sensor is prevented from contacting the bonding wire. Thus, the presence of the bonding wire is detected by the optical sensor which senses when the bonding wire is in contact with the wire-contact.