The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 1991
Filed:
Nov. 22, 1989
Applicant:
Inventors:
Mark F Bregman, Ridgefield, CT (US);
Raymond R Horton, Dover Plains, NY (US);
Ismail C Noyan, Peekskill, NY (US);
Michael J Palmer, Walden, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H05K / ;
U.S. Cl.
CPC ...
357 82 ; 357 80 ; 357 75 ; 361381 ; 361382 ; 361385 ;
Abstract
A three dimensional chip package comprising a plurality of semiconductor substrates, each having at least one semiconductor electronic device mounted thereon; wherein at least a subset of said plurality substrates are physically joined to form an enclosure within which each substrate has at least one electrical contact location to another substrate; and further wherein at least one cooling channel is provided within said enclosure into which a cooling fluid may be introduced.