The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 22, 1991
Filed:
Jun. 12, 1990
Toshihiro Yasuhara, Kokubunji, JP;
Masachika Masuda, Kodaira, JP;
Asao Nishimura, Ushiku, JP;
Naozumi Hatada, Yokohama, JP;
Sueo Kawai, Ibaragi, JP;
Makoto Kitano, Chiyoda, JP;
Hideo Miura, Chiyoda, JP;
Akihiro Yaguchi, Chiyoda, JP;
Gen Murakami, Machida, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
In a tabless lead frame wherein a space for laying inner leads is sufficiently secured when a lengthened and enlarged semiconductor pellet is placed or set in a resin-molding package, through holes are provided in leads for the purpose of increasing the occupation area ratio of a resin portion. Furthermore, each of the leads corresponding to the lower surface of the pellet is branched into a plurality of portions in the widthwise direction thereof in order to reduce a stress. Further, in an insulating sheet which is interposed between the leads and the pellet, the dimension of the shorter lateral sides thereof is set smaller than that of the shorter lateral sides of the pellet in order to prevent cracks from occurring at the end part of the insulating sheet.