The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 11, 1990
Filed:
Dec. 08, 1988
Applicant:
Inventors:
Masaki Narushima, Yamanashi, JP;
Itaru Takao, Yamanashi, JP;
Assignee:
Tokyo Electron Limited, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
B25B / ;
U.S. Cl.
CPC ...
269 21 ;
Abstract
A semiconductor wafer receiving apparatus has a base, a table for supporting a wafer, a receiving member having at least three receiving pins which project from a supporting surface and are concealed under the supporting surface upon vertical movement of the table, and a driving unit for vertically moving the table. The wafer is transferred onto the receiving pins while the receiving pins project, and is held on the table while the receiving pins are concealed.
Quick Actions:
Narushima, Masaki. (1990). Plate-like member receiving apparatus (U.S. Patent No. 4955590). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4955590
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile