The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 26, 1990

Filed:

Dec. 08, 1988
Applicant:
Inventors:

Janet M DeBlasi, Union City, CA (US);

Paulus Z Van Der Putte, Eindhoven, NL;

Assignee:

Signetics Corporation, Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
357 71 ; 357-2 ; 357 59 ; 437192 ; 437200 ;
Abstract

A self-aligned metallization for an MOS device is described in which a first layer of tungsten is selectively deposited on the exposed silicon surfaces of the device including at least the source, drain and gate regions of the device, a layer of material providing nucleation sites for tungsten is selectively formed across insulating oxide regions of the device, and a second tungsten layer is selectively deposited on the nucleating layer and the exposed first tungsten layer to provide interconnection across the oxide regions. In addition to having a low electrical resistivity, such a metallization enables relaxed mask alignment and etching tolerance requirements, and is therefore useful in VLSI circuits.


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