The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 06, 1990
Filed:
Nov. 07, 1988
Masatoshi Suehiro, Kyoto, JP;
Masashi Echigo, Kyoto, JP;
Masami Sakuraba, Nagaokakyo, JP;
Yutaka Mitsune, Daito, JP;
Seiichi Nakatani, Hirakata, JP;
Tsutomu Nishimura, Uji, JP;
Dai-Ichi Kogyo Seiyaku Co., Ltd., Kyoto, JP;
Dowa Mining Co., Ltd., Tokyo, JP;
Matsushita Electric Industrial Co., Kadoma, JP;
Abstract
A copper conductor composition having an improved solderability as well as a good adhesion, which comprises a copper powder, an inorganic binder and a boride or silicide of a metal such as W, Mo, Ti, Ta, Nb or Cr. The solderability is kept on a good level even if the composition is subjected to a firing operation repeatedly.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile