The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 1990
Filed:
May. 11, 1988
Nobuyuki Hayashi, Hitachi, JP;
Katsushige Tsukada, Hitachi, JP;
Tadashi Fujii, Hitachi, JP;
Katsunori Tsuchiya, Hitachi, JP;
Hitachi Chemical Company, Ltd., Tokyo, JP;
Ibiden Co., Ltd., Ogaki, JP;
Abstract
There is disclosed a photosensitive resin composition solution for formation of a printed wiring board permanent mask to be coated on a substrate to be coated according to the curtain flow coating method or the roll coating method, which comprises (A) an oligomer having at least one epoxy group and at least one polymerizable vinyl group in the side chain, (B) a photopolymerization initiator, (C) an epoxy resin curing agent, (D) a filler and (E) a solvent, characterized in that (1) the solvent (E) contains 10 to 20% by weight of at least one low boiling point solvent selected from the group consisting of methanol, ethanol, methyl ethyl ketone, acetone and ethyl acetate based on the total amount of the solvent, and (2) the composition solution has a viscosity at 25.degree. C. of 100 mPas or more and 200 mPas or less.