The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 07, 1989
Filed:
Dec. 14, 1987
James F Burgess, Schenectady, NY (US);
Homer H Glascock, II, Scotia, NY (US);
Harold F Webster, Scotia, NY (US);
Constantine A Neugebauer, Schenectady, NY (US);
James A Loughran, Scotia, NY (US);
General Electric Company, Schenectady, NY (US);
Abstract
Multilayer circuit boards composed primarily of silicon and containing buried ground planes and buried conducting runs are fabricated in one embodiment by positioning conductive patterns (12) on the surfaces of silicon substrates and melting a solder component of the conductive patterns (12) and allowing it to flow together with solder from the conductive patterns (12) on a stacked, adjacent silicon substrate (10). When the solder cools, a single conductive pathway (18) exists between adjacent silicon substrates (10) and bonds the adjacent substrates. If the substrates are coated with SiO.sub.2 (20), a multilayer structure with buried microwave strip lines (22) is formed in the bonding process. Alternatively, highly resistive silicon substrates (26) are used as a dielectric for microwave strip lines (24) on a top surface thereof and a conductive sheet (28) on the bottom surface thereof acts as a ground plane for microwave energy propagating along strip line (24).