The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 1987

Filed:

Feb. 08, 1985
Applicant:
Inventors:

Volker K Deutsch, Wuppertal, DE;

Werner F Roddeck, Velbert, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01B / ;
U.S. Cl.
CPC ...
324230 ; 118712 ; 324202 ; 324225 ; 427 10 ;
Abstract

A method of and apparatus for measuring the layer of coating thickness of non-magnetic substances on a ferromagnetic parent material by the magneto-inductive method or of non-metallic substances on a conductive parent material by the eddy current method. This is done with the use of a probe whose coil inductance is evaluated as a criterion for the thickness of the layer to be measured. An adjustment to the geometry and the magnetic properties of the specimen are made before the first measurement. In the adjustment, at least one non-magnetic or non-conductive foil is disposed or are consecutively disposed between the probe and the surface of the coated specimen and the measured data obtained then and in the subsequent measurements are fed to a microcomputer. In the semiconductor store of the micro-computer, the non-linear relationship between the coil inductance of at least one probe and the distance between the probe and the parent material is being or has been stored in the form of at least one values table and in which the layer thickness values of the foils are being or have been stored. The microcomputer calculates the thickness values of the layer material from the measurement data fed to it and from the stored data.


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