The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 29, 1985

Filed:

Nov. 15, 1982
Applicant:
Inventors:

Boris Meshman, Canoga Park, CA (US);

Thomas A Kerekes, Canoga Park, CA (US);

Lawrence S Green, Canoga Park, CA (US);

David Karlinsky, Canoga Park, CA (US);

Assignee:

TRE Semiconductor Equipment Corporation, Woodland Hills, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F / ; H05K / ; H04N / ;
U.S. Cl.
CPC ...
364490 ; 364559 ; 356401 ; 358101 ;
Abstract

A step-and-repeat exposure system incorporates a method for achieving die-by-die alignment at high speed in order to increase the throughput of the system. In order to align circuit patterns which are to be exposed onto a semiconductor wafer in an overlapping fashion, the wafer is initially moved to a target position in order to view an alignment target previously formed on the wafer, and is subsequently moved to an exposure position. The movement to the exposure position is controlled as a function of the calculated position of the alignment target. The method involves initiating the video scan to view the alignment target prior to the stage coming to a complete rest at the target position. The characteristics of the stage motion are determined and the acquisition of the video data is initiated as soon as the oscillation of the stage has subsided by an acceptable amount. By initiating the video scan at an early point, a significant decrease in the alignment time at each die site is achieved.


Find Patent Forward Citations

Loading…