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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 4188221 B1

PDFFull Text
Date of Patent:
Feb. 12, 1980

Filed:

May. 08, 1978

Photosensitive polyamide resin composition useful for making relief

Applicant:
Inventors:

Masaru Nanpei, Otsu, JP;

Toshiaki Fujimura, Otsu, JP;

Hajime Kouda, Otsu, JP;

Yoshihiro Kasho, Otsu, JP;

Kuniomi Etoh, Otsu, JP;

Assignee:

Toyo Boseki Kabushiki Kaisha, , JP;

Attorney:

Jones, Tullar & Cooper

Primary Examiner:

John D Welsh

Int. Cl.
CPC ...
G03C / ;
U.S. Cl.
CPC ...
430288 ; 430306 ; 430906 ; 20415916 ; 20415922 ;
Abstract

Photosensitive polyamide resin composition which can be developed with water to give a relief printing plate having an excellent moisture resistance, comprising 30 to 90% by weight of a water-soluble polyamide having ammonium type nitrogen atoms and 5 to 70% by weight of a photopolymerizable unsaturated compound prepared by reacting (meth)acrylic acid (I) and a polyglycidyl ether of an aliphatic polyvalent alcohol (II) in an equivalent ratio of 0.5.ltoreq.(I)/(II).ltoreq.2.0, and 0.01 to 10% by weight of a photopolymerization initiator.

Find Patent Forward Citations

Nanpei, Masaru. (1980). Photosensitive polyamide resin composition useful for making relief (U.S. Patent No. 4188221). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4188221

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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